Two types of scanning electron microscopy (SEM) systems are available through Innovatech Labs – Variable Pressure SEM (VPSEM) and Field Emission SEM (FESEM). Having access to both systems allows us to meet the demands of the most challenging projects in materials characterization and failure analysis. The table below compares SEM applications for each of the systems.
|SEM APPLICATION||CONVENTIONAL SEM||VARIABLE PRESSURE SEM (VPSEM)||SEM (FESEM)|
|Metal Fractures||Low to moderate magnification examination for mechanism and material anomalies||High resolution imaging for very fine features, such as sub-micron fatigue striations|
|Polymer Fractures||Imaging of fine fracture features with coating||Evaluation of general fracture features without coating||Imaging of fine fracture features using low voltage (uncoated) or higher voltage with coating|
|Semiconductors||Examinations at moderate magnifications (20,000X) and microanalysis of phases and features -usually coating||Examinations at moderate magnifications (20,000X) and microanalysis of phases and features without coating||High resolution imaging of very fine features and phases with microanalysis|
|Microstructures||Imaging and microanalysis of conductive materials without coating||Imaging and microanalysis of conductive or nonconductive materials without coating||High resolution imaging of very fine features and phases with microanalysis|
|Foreign Material||Imaging and microanalysis of conductive materials uncoated or nonconductive materials with coating||Imaging and microanalysis of conductive or nonconductive materials without coating||Microanalysis on conductive samples only or with carbon coating|
|Biological Materials||Imaging possible after drying and coating||Backscattered imaging without coating - some examination of "wet" samples is possible||High resolution imaging after drying and coating|